EP4CE75F23C6N
vs
EP4CE75F23C8N
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484
23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484
Pin Count
484
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
472.5 MHz
472.5 MHz
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e1
e1
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
4713
4713
Number of Inputs
295
295
Number of Logic Cells
75408
75408
Number of Outputs
295
295
Number of Terminals
484
484
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
4713 CLBS
4713 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
2.4 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
23 mm
23 mm
Base Number Matches
1
1
ECCN Code
3A991
Samacsys Manufacturer
Intel
Compare EP4CE75F23C6N with alternatives
Compare EP4CE75F23C8N with alternatives