EP4CE6F17C7 vs EP4CE6F17C8N feature comparison

EP4CE6F17C7 Intel Corporation

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EP4CE6F17C8N Altera Corporation

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Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 17 X 17 MM, 1 MM PITCH, FBGA-256 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 472.5 MHz 472.5 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 392 392
Number of Inputs 179 179
Number of Logic Cells 6272 6272
Number of Outputs 179 179
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 392 CLBS 392 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Pin Count 256
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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