EP4CE30F29I8LN vs EP4CE30F29I7N feature comparison

EP4CE30F29I8LN Intel Corporation

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EP4CE30F29I7N Intel Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780
Reach Compliance Code compliant compliant
ECCN Code 3A991
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel Intel
Clock Frequency-Max 362 MHz 472.5 MHz
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e1 e1
Length 29 mm 29 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1803 1803
Number of Inputs 535 535
Number of Logic Cells 28848 28848
Number of Outputs 535 535
Number of Terminals 780 780
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1803 CLBS 1803 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 2.4 mm
Supply Voltage-Max 1.03 V 1.25 V
Supply Voltage-Min 0.97 V 1.15 V
Supply Voltage-Nom 1 V 1.2 V
Surface Mount YES YES
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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