EP3SL70F780C2N vs EP3SL70F780I3L feature comparison

EP3SL70F780C2N Intel Corporation

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EP3SL70F780I3L Intel Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description LEAD FREE, FBGA-780 BGA, BGA780,28X28,40
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
JESD-30 Code S-PBGA-B780 S-PBGA-B780
Length 29 mm 29 mm
Number of CLBs 2700
Number of Inputs 488 488
Number of Logic Cells 67500 67500
Number of Outputs 488 488
Number of Terminals 780 780
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 2700 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.2 mm 3.5 mm
Supply Voltage-Max 0.94 V
Supply Voltage-Min 0.86 V
Supply Voltage-Nom 0.9 V
Surface Mount YES YES
Temperature Grade OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 29 mm 29 mm
Base Number Matches 1 2
Clock Frequency-Max 100 MHz
JESD-609 Code e0
Moisture Sensitivity Level 1
Technology CMOS
Terminal Finish TIN LEAD

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