EP3SL50F780I3LN vs EP3SE50F780I3L feature comparison

EP3SL50F780I3LN Intel Corporation

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EP3SE50F780I3L Intel Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description BGA, BGA780,28X28,40 BGA, BGA780,28X28,40
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 100 MHz 100 MHz
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e1 e0
Length 29 mm 29 mm
Number of Inputs 488 488
Number of Logic Cells 47500 47500
Number of Outputs 488 488
Number of Terminals 780 780
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 1900 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.2 mm 3.5 mm
Supply Voltage-Max 0.94 V
Supply Voltage-Min 0.86 V
Supply Voltage-Nom 0.9 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 1 2
Moisture Sensitivity Level 1

Compare EP3SL50F780I3LN with alternatives

Compare EP3SE50F780I3L with alternatives