EP3SL50F484C2 vs EP3SE50F484I4L feature comparison

EP3SL50F484C2 Altera Corporation

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EP3SE50F484I4L Intel Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description BGA, BGA484,22X22,40 FBGA-484
Pin Count 484
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 800 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3
Number of Inputs 296 296
Number of Logic Cells 47500 47500
Number of Outputs 296 296
Number of Terminals 484 484
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220 NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.2 mm
Supply Voltage-Max 0.94 V 0.94 V
Supply Voltage-Min 0.86 V 0.86 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Width 23 mm 23 mm
Base Number Matches 2 2
Number of CLBs 1900
Organization 1900 CLBS

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