EP3SL200H780I4LG
vs
EP3SL200H780C3L
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
HBGA-780
|
BGA, BGA780,28X28,40
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATES AT 1.1V VCC NOMINAL
|
|
| JESD-30 Code |
S-PBGA-B780
|
S-PBGA-B780
|
| Length |
33 mm
|
|
| Number of CLBs |
8000
|
|
| Number of Logic Cells |
200000
|
200000
|
| Number of Terminals |
780
|
780
|
| Operating Temperature-Max |
100 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
8000 CLBS
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA780,28X28,40
|
BGA780,28X28,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
3.2 mm
|
|
| Supply Voltage-Max |
0.94 V
|
|
| Supply Voltage-Min |
0.86 V
|
|
| Supply Voltage-Nom |
0.9 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
33 mm
|
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Clock Frequency-Max |
|
100 MHz
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Number of Inputs |
|
488
|
| Number of Outputs |
|
488
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare EP3SL200H780I4LG with alternatives
Compare EP3SL200H780C3L with alternatives