EP3SL200H780I3LN
vs
EP3SL200H780I4LN
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
BGA, BGA780,28X28,40
|
LEAD FREE, HBGA-780
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
100 MHz
|
717 MHz
|
JESD-30 Code |
S-PBGA-B780
|
S-PBGA-B780
|
JESD-609 Code |
e1
|
|
Number of Inputs |
488
|
488
|
Number of Logic Cells |
200000
|
200000
|
Number of Outputs |
488
|
488
|
Number of Terminals |
780
|
780
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
8000 CLBS
|
8000 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA780,28X28,40
|
BGA780,28X28,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
0.94 V
|
0.94 V
|
Supply Voltage-Min |
0.86 V
|
0.86 V
|
Supply Voltage-Nom |
0.9 V
|
0.9 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
2
|
2
|
Additional Feature |
|
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
|
Length |
|
33 mm
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Seated Height-Max |
|
3.5 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
33 mm
|
|
|
|
Compare EP3SL200H780I3LN with alternatives
Compare EP3SL200H780I4LN with alternatives