EP3SL200H780C4L vs EP3SL200H780C3N feature comparison

EP3SL200H780C4L Intel Corporation

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EP3SL200H780C3N Intel Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description HBGA-780 LEAD FREE, HBGA-780
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
JESD-30 Code S-PBGA-B780 S-PBGA-B780
Length 33 mm 33 mm
Number of CLBs 8000 8000
Number of Inputs 488 488
Number of Logic Cells 200000 200000
Number of Outputs 488 488
Number of Terminals 780 780
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 8000 CLBS 8000 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.2 mm 3.2 mm
Supply Voltage-Max 0.94 V 0.94 V
Supply Voltage-Min 0.86 V 0.86 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 33 mm 33 mm
Base Number Matches 3 1

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