Findchips: Compare EP3SL200H780C3 vs EP3SL200H780I4LN

EP3SL200H780C3 vs EP3SL200H780I4LN feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	ALTERA CORP	INTEL CORP
Part Package Code	BGA
Package Description	BGA, BGA780,28X28,40	LEAD FREE, HBGA-780
Pin Count	780
Reach Compliance Code	not_compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Additional Feature	IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY	IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max	717 MHz	717 MHz
JESD-30 Code	S-PBGA-B780	S-PBGA-B780
JESD-609 Code	e0
Length	33 mm	33 mm
Moisture Sensitivity Level	3
Number of Inputs	488	488
Number of Logic Cells	200000	200000
Number of Outputs	488	488
Number of Terminals	780	780
Operating Temperature-Max	85 °C	100 °C
Operating Temperature-Min		-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA780,28X28,40	BGA780,28X28,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	220	NOT SPECIFIED
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.5 mm	3.5 mm
Supply Voltage-Max	0.94 V	0.94 V
Supply Voltage-Min	0.86 V	0.86 V
Supply Voltage-Nom	0.9 V	0.9 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	OTHER
Terminal Finish	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	20	NOT SPECIFIED
Width	33 mm	33 mm
Base Number Matches	2	2
Organization		8000 CLBS
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays