Findchips: Compare EP3SL200F1517I3L vs EP3SL200F1517C3L

EP3SL200F1517I3L vs EP3SL200F1517C3L feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	INTEL CORP	INTEL CORP
Package Description	BGA, BGA1517,39X39,40	BGA, BGA1517,39X39,40
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	100 MHz	100 MHz
JESD-30 Code	S-PBGA-B1517	S-PBGA-B1517
JESD-609 Code	e0	e0
Length	40 mm	40 mm
Moisture Sensitivity Level	1	1
Number of Inputs	976	976
Number of Logic Cells	200000	200000
Number of Outputs	976	976
Number of Terminals	1517	1517
Operating Temperature-Max	100 °C	85 °C
Operating Temperature-Min	-40 °C
Organization	8000 CLBS	8000 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA1517,39X39,40	BGA1517,39X39,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.7 mm	3.7 mm
Supply Voltage-Max	1.15 V	1.15 V
Supply Voltage-Min	1.05 V	1.05 V
Supply Voltage-Nom	1.1 V	1.1 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Finish	TIN LEAD	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	40 mm	40 mm
Base Number Matches	2	2
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays