EP3SL200F1152I4
vs
EP3SL200F1152C2N
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA1152,34X34,40
|
BGA, BGA1152,34X34,40
|
| Pin Count |
1152
|
1152
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
|
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
|
| Clock Frequency-Max |
717 MHz
|
800 MHz
|
| JESD-30 Code |
S-PBGA-B1152
|
S-PBGA-B1152
|
| JESD-609 Code |
e0
|
e1
|
| Length |
35 mm
|
35 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of Inputs |
744
|
744
|
| Number of Logic Cells |
200000
|
200000
|
| Number of Outputs |
744
|
744
|
| Number of Terminals |
1152
|
1152
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA1152,34X34,40
|
BGA1152,34X34,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
220
|
245
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.9 mm
|
3.9 mm
|
| Supply Voltage-Max |
0.94 V
|
0.94 V
|
| Supply Voltage-Min |
0.86 V
|
0.86 V
|
| Supply Voltage-Nom |
0.9 V
|
0.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
30
|
| Width |
35 mm
|
35 mm
|
| Base Number Matches |
4
|
1
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Temperature Grade |
|
OTHER
|
|
|
|
Compare EP3SL200F1152I4 with alternatives
Compare EP3SL200F1152C2N with alternatives