EP3SL200F1152C4L vs EP3SL200F1152I3N feature comparison

EP3SL200F1152C4L Intel Corporation

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EP3SL200F1152I3N Intel Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description FBGA-1152 FBGA-1152
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
Length 35 mm 35 mm
Number of CLBs 8000 8000
Number of Inputs 744 744
Number of Logic Cells 200000 200000
Number of Outputs 744 744
Number of Terminals 1152 1152
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 8000 CLBS 8000 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.6 mm 3.6 mm
Supply Voltage-Max 0.94 V 0.94 V
Supply Voltage-Min 0.86 V 0.86 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Temperature Grade OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 35 mm 35 mm
Base Number Matches 2 2

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