EP3SL150F1152C4LG
vs
EP3SL150F1152C3LN
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
FBGA-1152
|
BGA, BGA1152,34X34,40
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
Additional Feature |
ALSO OPERATES AT 1.1V VCC NOMINAL
|
|
JESD-30 Code |
S-PBGA-B1152
|
S-PBGA-B1152
|
Length |
35 mm
|
|
Number of CLBs |
5700
|
|
Number of Logic Cells |
142500
|
142500
|
Number of Terminals |
1152
|
1152
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
5700 CLBS
|
5700 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1152,34X34,40
|
BGA1152,34X34,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
3.5 mm
|
|
Supply Voltage-Max |
0.94 V
|
0.94 V
|
Supply Voltage-Min |
0.86 V
|
0.86 V
|
Supply Voltage-Nom |
0.9 V
|
0.9 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
35 mm
|
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Clock Frequency-Max |
|
100 MHz
|
JESD-609 Code |
|
e1
|
Number of Inputs |
|
744
|
Number of Outputs |
|
744
|
Qualification Status |
|
Not Qualified
|
Technology |
|
CMOS
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare EP3SL150F1152C4LG with alternatives
Compare EP3SL150F1152C3LN with alternatives