EP3SL150F1152C2L vs EP3SL150F1152I3 feature comparison

EP3SL150F1152C2L Intel Corporation

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EP3SL150F1152I3 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description BGA, BGA1152,34X34,40 FBGA-1152
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 100 MHz 717 MHz
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e0
Moisture Sensitivity Level 1
Number of Inputs 744 744
Number of Logic Cells 142500 142500
Number of Outputs 744 744
Number of Terminals 1152 1152
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 5
Samacsys Manufacturer Intel
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Length 35 mm
Number of Equivalent Gates 3600000
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 5700 CLBS
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 3.9 mm
Supply Voltage-Max 0.94 V
Supply Voltage-Min 0.86 V
Supply Voltage-Nom 0.9 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 35 mm

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