EP3SL110F1152C4LN
vs
EP3SL110F1152C4LG
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA, BGA1152,34X34,40
|
FBGA-1152
|
| Pin Count |
1152
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
|
ALSO OPERATES AT 1.1V VCC NOMINAL
|
| Clock Frequency-Max |
717 MHz
|
|
| JESD-30 Code |
S-PBGA-B1152
|
S-PBGA-B1152
|
| JESD-609 Code |
e1
|
|
| Length |
35 mm
|
35 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Inputs |
744
|
|
| Number of Logic Cells |
107500
|
107500
|
| Number of Outputs |
744
|
|
| Number of Terminals |
1152
|
1152
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA1152,34X34,40
|
BGA1152,34X34,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
NOT SPECIFIED
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.9 mm
|
3.5 mm
|
| Supply Voltage-Max |
0.94 V
|
0.94 V
|
| Supply Voltage-Min |
0.86 V
|
0.86 V
|
| Supply Voltage-Nom |
0.9 V
|
0.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
35 mm
|
35 mm
|
| Base Number Matches |
2
|
1
|
| Number of CLBs |
|
4300
|
| Organization |
|
4300 CLBS
|
|
|
|
Compare EP3SL110F1152C4LN with alternatives
Compare EP3SL110F1152C4LG with alternatives