EP3SE50F484C3L vs EP3SE50F484I4N feature comparison

EP3SE50F484C3L Intel Corporation

Buy Now Datasheet

EP3SE50F484I4N Intel Corporation

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description BGA, BGA484,22X22,40 LEAD FREE, FBGA-484
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 100 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0
Moisture Sensitivity Level 1
Number of Inputs 296 296
Number of Logic Cells 47500 47500
Number of Outputs 296 296
Number of Terminals 484 484
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 1
Samacsys Manufacturer Intel
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Length 23 mm
Number of CLBs 1900
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 1900 CLBS
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 3.2 mm
Supply Voltage-Max 0.94 V
Supply Voltage-Min 0.86 V
Supply Voltage-Nom 0.9 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 23 mm

Compare EP3SE50F484C3L with alternatives

Compare EP3SE50F484I4N with alternatives