EP3SE50F484C3
vs
EP3SL50F484C3N
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
BGA, BGA484,22X22,40
LEAD FREE, FBGA-484
Pin Count
484
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max
717 MHz
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e0
Length
23 mm
23 mm
Moisture Sensitivity Level
3
Number of Inputs
296
296
Number of Logic Cells
47500
47500
Number of Outputs
296
296
Number of Terminals
484
484
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
NOT SPECIFIED
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.2 mm
Supply Voltage-Max
0.94 V
0.94 V
Supply Voltage-Min
0.86 V
0.86 V
Supply Voltage-Nom
0.9 V
0.9 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Width
23 mm
23 mm
Base Number Matches
2
2
Samacsys Manufacturer
Intel
Number of CLBs
1900
Organization
1900 CLBS
Compare EP3SE50F484C3 with alternatives
Compare EP3SL50F484C3N with alternatives