Findchips: Compare EP3SE260F1152C3LN vs EP3SE110F1152I4N

EP3SE260F1152C3LN vs EP3SE110F1152I4N feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	INTEL CORP	ALTERA CORP
Package Description	BGA, BGA1152,34X34,40	BGA, BGA1152,34X34,40
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	100 MHz	717 MHz
JESD-30 Code	S-PBGA-B1152	S-PBGA-B1152
JESD-609 Code	e1	e1
Length	35 mm	35 mm
Number of Inputs	744	744
Number of Logic Cells	255000	107500
Number of Outputs	744	744
Number of Terminals	1152	1152
Operating Temperature-Max	85 °C
Operating Temperature-Min
Organization	10200 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA1152,34X34,40	BGA1152,34X34,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.5 mm	3.9 mm
Supply Voltage-Max	0.94 V	0.94 V
Supply Voltage-Min	0.86 V	0.86 V
Supply Voltage-Nom	0.9 V	0.9 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Finish	TIN SILVER COPPER	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	35 mm	35 mm
Base Number Matches	2	2
Part Package Code		BGA
Pin Count		1152
Additional Feature		IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Moisture Sensitivity Level		3
Peak Reflow Temperature (Cel)		245
Time@Peak Reflow Temperature-Max (s)		30
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays