EP3SE110F1152C3L vs EP3SE110F1152C3 feature comparison

EP3SE110F1152C3L Intel Corporation

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EP3SE110F1152C3 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description BGA, BGA1152,34X34,40 FBGA-1152
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 100 MHz 717 MHz
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e0
Moisture Sensitivity Level 1
Number of Inputs 744 744
Number of Logic Cells 107500 107500
Number of Outputs 744 744
Number of Terminals 1152 1152
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 2
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Length 35 mm
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 4300 CLBS
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 3.9 mm
Supply Voltage-Max 0.94 V
Supply Voltage-Min 0.86 V
Supply Voltage-Nom 0.9 V
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 35 mm

Compare EP3SE110F1152C3L with alternatives

Compare EP3SE110F1152C3 with alternatives