EP3C5F256I7N
vs
EP3C5F256C6
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256
|
17 X 17 MM, 1 MM PITCH, FBGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
Intel
|
Clock Frequency-Max |
472.5 MHz
|
472.5 MHz
|
JESD-30 Code |
R-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e1
|
e0
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
5136
|
5136
|
Number of Inputs |
182
|
182
|
Number of Logic Cells |
5136
|
5136
|
Number of Outputs |
182
|
182
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
5136 CLBS
|
5136 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
235
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.55 mm
|
1.55 mm
|
Supply Voltage-Max |
1.25 V
|
1.25 V
|
Supply Voltage-Min |
1.15 V
|
1.15 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Lead (Sn63Pb37)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare EP3C5F256I7N with alternatives
Compare EP3C5F256C6 with alternatives