EP3C55F780I7
vs
EP3C55F780C8N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
29 X 29 MM, 1 MM PITCH, FBGA-780
29 X 29 MM, 2.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-780
Pin Count
780
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
472.5 MHz
472.5 MHz
JESD-30 Code
S-PBGA-B780
R-PBGA-B780
JESD-609 Code
e0
e1
Length
29 mm
29 mm
Moisture Sensitivity Level
3
3
Number of CLBs
55856
55856
Number of Inputs
377
377
Number of Logic Cells
55856
55856
Number of Outputs
377
377
Number of Terminals
780
780
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
55856 CLBS
55856 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA780,28X28,40
BGA780,28X28,40
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
3.5 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
30
Width
29 mm
29 mm
Base Number Matches
2
1
Samacsys Manufacturer
Intel
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