EP3C55F780C8
vs
EP3C55F780C7N
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
INTEL CORP
INTEL CORP
Package Description
29 X 29 MM, 1 MM PITCH, FBGA-780
29 X 29 MM, 2.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-780
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
472.5 MHz
472.5 MHz
JESD-30 Code
S-PBGA-B780
R-PBGA-B780
JESD-609 Code
e0
e1
Length
29 mm
29 mm
Moisture Sensitivity Level
3
3
Number of CLBs
55856
55856
Number of Inputs
377
377
Number of Logic Cells
55856
55856
Number of Outputs
377
377
Number of Terminals
780
780
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
55856 CLBS
55856 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA780,28X28,40
BGA780,28X28,40
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
3.5 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
29 mm
Base Number Matches
2
1
Samacsys Manufacturer
Intel
Compare EP3C55F780C8 with alternatives
Compare EP3C55F780C7N with alternatives