EP3C55F780C8 vs EP3C55F780C7N feature comparison

EP3C55F780C8 Intel Corporation

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EP3C55F780C7N Intel Corporation

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 29 X 29 MM, 1 MM PITCH, FBGA-780 29 X 29 MM, 2.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-780
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 472.5 MHz 472.5 MHz
JESD-30 Code S-PBGA-B780 R-PBGA-B780
JESD-609 Code e0 e1
Length 29 mm 29 mm
Moisture Sensitivity Level 3 3
Number of CLBs 55856 55856
Number of Inputs 377 377
Number of Logic Cells 55856 55856
Number of Outputs 377 377
Number of Terminals 780 780
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 55856 CLBS 55856 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 3.5 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 2 1
Samacsys Manufacturer Intel

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