EP3C40F780C6N
vs
EP3C40F780C7
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
29 X 29 MM, 2.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-780
29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Intel
Clock Frequency-Max
472.5 MHz
472.5 MHz
JESD-30 Code
R-PBGA-B780
S-PBGA-B780
JESD-609 Code
e1
e0
Length
29 mm
29 mm
Moisture Sensitivity Level
3
3
Number of CLBs
39600
39600
Number of Inputs
535
535
Number of Logic Cells
39600
39600
Number of Outputs
535
535
Number of Terminals
780
780
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
39600 CLBS
39600 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA780,28X28,40
BGA780,28X28,40
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
2.4 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
29 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
780
Peak Reflow Temperature (Cel)
220
Time@Peak Reflow Temperature-Max (s)
20
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