EP3C40F324C8N
vs
EP3C40F324I7N
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
ALTERA CORP
|
ALTERA CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
19 X 19 MM, 2.20 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-324
|
19 X 19 MM, 2.20 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-324
|
Pin Count |
324
|
324
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
Intel
|
Clock Frequency-Max |
472.5 MHz
|
472.5 MHz
|
JESD-30 Code |
R-PBGA-B324
|
R-PBGA-B324
|
JESD-609 Code |
e1
|
e1
|
Length |
19 mm
|
19 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
39600
|
39600
|
Number of Inputs |
195
|
195
|
Number of Logic Cells |
39600
|
39600
|
Number of Outputs |
195
|
195
|
Number of Terminals |
324
|
324
|
Operating Temperature-Max |
85 °C
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
39600 CLBS
|
39600 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA324,18X18,40
|
BGA324,18X18,40
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.2 mm
|
2.2 mm
|
Supply Voltage-Max |
1.25 V
|
1.25 V
|
Supply Voltage-Min |
1.15 V
|
1.15 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
19 mm
|
19 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare EP3C40F324C8N with alternatives
Compare EP3C40F324I7N with alternatives