EP3C40F324C8N
vs
EP3C40F324C6
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
BGA
BGA
Package Description
19 X 19 MM, 2.20 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-324
19 X 19 MM, 1 MM PITCH, FBGA-324
Pin Count
324
324
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
472.5 MHz
472.5 MHz
JESD-30 Code
R-PBGA-B324
S-PBGA-B324
JESD-609 Code
e1
e0
Length
19 mm
19 mm
Moisture Sensitivity Level
3
3
Number of CLBs
39600
39600
Number of Inputs
195
195
Number of Logic Cells
39600
39600
Number of Outputs
195
195
Number of Terminals
324
324
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
39600 CLBS
39600 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA324,18X18,40
BGA324,18X18,40
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
220
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
1.9 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
20
Width
19 mm
19 mm
Base Number Matches
1
2
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