Findchips: Compare EP3C25U256C8NES vs EP3C25U256C6

EP3C25U256C8NES vs EP3C25U256C6 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	ALTERA CORP	ALTERA CORP
Part Package Code	BGA	BGA
Package Description	FBGA,	14 X 14 MM, 0.80 MM PITCH, UBGA-256
Pin Count	256	256
Reach Compliance Code	compliant	not_compliant
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	472.5 MHz	472.5 MHz
JESD-30 Code	R-PBGA-B256	S-PBGA-B256
JESD-609 Code	e1	e0
Length	14 mm	14 mm
Number of CLBs	24624	24624
Number of Terminals	256	256
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min
Organization	24624 CLBS	24624 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	FBGA	LFBGA
Package Equivalence Code	BGA256,16X16,32	BGA256,16X16,32
Package Shape	RECTANGULAR	SQUARE
Package Style	GRID ARRAY, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.2 mm	1.5 mm
Supply Voltage-Max	1.25 V	1.25 V
Supply Voltage-Min	1.15 V	1.15 V
Supply Voltage-Nom	1.2 V	1.2 V
Surface Mount	YES	YES
Temperature Grade	OTHER	OTHER
Terminal Finish	TIN SILVER COPPER	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM
Width	14 mm	14 mm
Base Number Matches	1	2
Pbfree Code		No
Rohs Code		No
Moisture Sensitivity Level		3
Number of Inputs		156
Number of Logic Cells		24624
Number of Outputs		156
Peak Reflow Temperature (Cel)		235
Technology		CMOS
Time@Peak Reflow Temperature-Max (s)		20
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays