EP3C25U256C7N
vs
EP3C25U256I7
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
14 X 14 MM, 2.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, UFBGA-256
14 X 14 MM, 0.80 MM PITCH, UBGA-256
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
472.5 MHz
472.5 MHz
JESD-30 Code
R-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e0
Length
14 mm
14 mm
Moisture Sensitivity Level
3
3
Number of CLBs
24624
24624
Number of Inputs
156
156
Number of Logic Cells
24624
24624
Number of Outputs
156
156
Number of Terminals
256
256
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
24624 CLBS
24624 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
LFBGA
Package Equivalence Code
BGA256,16X16,32
BGA256,16X16,32
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
1.5 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
256
Peak Reflow Temperature (Cel)
235
Time@Peak Reflow Temperature-Max (s)
20
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