EP3C25U256C7 vs EP3C25U256C8NES feature comparison

EP3C25U256C7 Intel Corporation

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EP3C25U256C8NES Intel Corporation

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Rohs Code No
Part Life Cycle Code Active Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 14 X 14 MM, 0.80 MM PITCH, UBGA-256 14 X 14 MM, 2.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, UFBGA-256
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 472.5 MHz 472.5 MHz
JESD-30 Code S-PBGA-B256 R-PBGA-B256
JESD-609 Code e0 e1
Length 14 mm 14 mm
Moisture Sensitivity Level 3
Number of CLBs 24624 24624
Number of Inputs 156 156
Number of Logic Cells 24624
Number of Outputs 156 156
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 24624 CLBS 24624 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA FBGA
Package Equivalence Code BGA256,16X16,32 BGA256,16X16,32
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 2.2 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 2 2

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Compare EP3C25U256C8NES with alternatives