EP3C25U256C6N
vs
EP3C25U256I7N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Ihs Manufacturer
INTEL CORP
Package Description
14 X 14 MM, 2.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, UFBGA-256
Reach Compliance Code
compliant
HTS Code
8542.39.00.01
Clock Frequency-Max
472.5 MHz
JESD-30 Code
R-PBGA-B256
JESD-609 Code
e1
Length
14 mm
Moisture Sensitivity Level
3
Number of CLBs
24624
Number of Inputs
156
Number of Logic Cells
24624
Number of Outputs
156
Number of Terminals
256
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
24624 CLBS
Package Body Material
PLASTIC/EPOXY
Package Code
FBGA
Package Equivalence Code
BGA256,16X16,32
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.2 mm
Supply Voltage-Max
1.25 V
Supply Voltage-Min
1.15 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Width
14 mm
Base Number Matches
1
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