EP3C16U484I7
vs
EP3C16U484C6
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
19 X 19 MM, 2.20 MM HEIGHT, 0.80 MM PITCH, UFBGA-484
|
19 X 19 MM, 2.20 MM HEIGHT, 0.80 MM PITCH, UFBGA-484
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
Intel
|
| Clock Frequency-Max |
472.5 MHz
|
472.5 MHz
|
| JESD-30 Code |
R-PBGA-B484
|
R-PBGA-B484
|
| Length |
19 mm
|
19 mm
|
| Number of CLBs |
15408
|
15408
|
| Number of Inputs |
346
|
346
|
| Number of Logic Cells |
15408
|
15408
|
| Number of Outputs |
346
|
346
|
| Number of Terminals |
484
|
484
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
15408 CLBS
|
15408 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
FBGA
|
| Package Equivalence Code |
BGA484,22X22,32
|
BGA484,22X22,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.2 mm
|
2.2 mm
|
| Supply Voltage-Max |
1.25 V
|
1.25 V
|
| Supply Voltage-Min |
1.15 V
|
1.15 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
19 mm
|
19 mm
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare EP3C16U484I7 with alternatives
Compare EP3C16U484C6 with alternatives