EP3C16M164C7N vs EP3C16M164I7 feature comparison

EP3C16M164C7N Altera Corporation

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EP3C16M164I7 Intel Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description LEAD FREE, MBGA-164 8 X 8 MM, 0.50 MM PITCH, FBGA-164
Pin Count 164
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
JESD-30 Code S-PBGA-B164 S-PBGA-B164
JESD-609 Code e1
Moisture Sensitivity Level 3
Number of CLBs 15408 15408
Number of Inputs 92 92
Number of Logic Cells 15408 15408
Number of Outputs 92 92
Number of Terminals 164 164
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 15408 CLBS 15408 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TFBGA
Package Equivalence Code BGA164,15X15,20 BGA164,15X15,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 2.625 V 1.25 V
Supply Voltage-Min 2.375 V 1.15 V
Supply Voltage-Nom 2.5 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 2 2
Length 8 mm
Seated Height-Max 1.2 mm
Width 8 mm

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