EP3C16F484C8N
vs
EP3C16F484I7N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
BGA
BGA
Package Description
23 X 23 MM, 2.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484
23 X 23 MM, 2.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484
Pin Count
484
484
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
472.5 MHz
472.5 MHz
JESD-30 Code
R-PBGA-B484
R-PBGA-B484
JESD-609 Code
e1
e1
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
15408
15408
Number of Inputs
346
346
Number of Logic Cells
15408
15408
Number of Outputs
346
346
Number of Terminals
484
484
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
15408 CLBS
15408 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
Base Number Matches
2
2
Compare EP3C16F484C8N with alternatives
Compare EP3C16F484I7N with alternatives