EP3C10U256C7
vs
EP3C10U256C8N
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
14 X 14 MM, 0.80 MM PITCH, UBGA-256
|
14 X 14 MM, 2.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, UFBGA-256
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
Intel
|
| Clock Frequency-Max |
472.5 MHz
|
472.5 MHz
|
| JESD-30 Code |
S-PBGA-B256
|
R-PBGA-B256
|
| JESD-609 Code |
e0
|
e1
|
| Length |
14 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
10320
|
10320
|
| Number of Inputs |
182
|
182
|
| Number of Logic Cells |
10320
|
10320
|
| Number of Outputs |
182
|
182
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
10320 CLBS
|
10320 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
FBGA
|
| Package Equivalence Code |
BGA256,16X16,32
|
BGA256,16X16,32
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.5 mm
|
2.2 mm
|
| Supply Voltage-Max |
1.25 V
|
1.25 V
|
| Supply Voltage-Min |
1.15 V
|
1.15 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare EP3C10U256C7 with alternatives
Compare EP3C10U256C8N with alternatives