EP3C10F256C7
vs
EP3C10F256I7N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
BGA
BGA
Package Description
17 X 17 MM, 1 MM PITCH, FBGA-256
17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256
Pin Count
256
256
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
472.5 MHz
472.5 MHz
JESD-30 Code
S-PBGA-B256
R-PBGA-B256
JESD-609 Code
e0
e1
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
10320
10320
Number of Inputs
182
182
Number of Logic Cells
10320
10320
Number of Outputs
182
182
Number of Terminals
256
256
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
10320 CLBS
10320 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
235
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
30
Width
17 mm
17 mm
Base Number Matches
2
2
Compare EP3C10F256C7 with alternatives
Compare EP3C10F256I7N with alternatives