EP3C10F256A7N
vs
EP3C10F256A7N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
LEAD FREE, MS-034, FBGA-256
LEAD FREE, MS-034, FBGA-256
Pin Count
256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e1
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
10320
10320
Number of Inputs
182
182
Number of Logic Cells
10320
10320
Number of Outputs
182
182
Number of Terminals
256
256
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
10320 CLBS
10320 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
17 mm
17 mm
Base Number Matches
1
1
Samacsys Manufacturer
Intel
Clock Frequency-Max
472.5 MHz
Compare EP3C10F256A7N with alternatives
Compare EP3C10F256A7N with alternatives