EP2SGX90EF1152C4N
vs
EP2SGX90EF1152C4ES
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
LEAD FREE, MS-034AAR-1, FBGA-1152
|
35 X 35 MM, FPGA-1152
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
717 MHz
|
|
Combinatorial Delay of a CLB-Max |
5.117 ns
|
|
JESD-30 Code |
S-PBGA-B1152
|
S-PBGA-B1152
|
JESD-609 Code |
e1
|
e0
|
Length |
35 mm
|
35 mm
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
90960
|
4828
|
Number of Inputs |
558
|
|
Number of Logic Cells |
90960
|
|
Number of Outputs |
558
|
|
Number of Terminals |
1152
|
1152
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
90960 CLBS
|
4828 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1152,34X34,40
|
BGA1152,34X34,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.5 mm
|
3.5 mm
|
Supply Voltage-Max |
1.25 V
|
1.25 V
|
Supply Voltage-Min |
1.15 V
|
1.15 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare EP2SGX90EF1152C4N with alternatives
Compare EP2SGX90EF1152C4ES with alternatives