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EP2SGX60DF780C3N vs EP2SGX60DF780C4N feature comparison

EP2SGX60DF780C3N Intel Corporation

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EP2SGX60DF780C4N Intel Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780 29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel Intel
Clock Frequency-Max 717 MHz 717 MHz
Combinatorial Delay of a CLB-Max 4.45 ns 5.117 ns
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e1 e1
Length 29 mm 29 mm
Moisture Sensitivity Level 3 3
Number of CLBs 60440 60440
Number of Inputs 364 364
Number of Logic Cells 60440 60440
Number of Outputs 364 364
Number of Terminals 780 780
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 60440 CLBS 60440 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 2 2
ECCN Code 3A991
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

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