EP2SGX60CF780I3N vs EP2SGX60DF780I4 feature comparison

EP2SGX60CF780I3N Altera Corporation

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EP2SGX60DF780I4 Altera Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code BGA BGA
Package Description 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 29 X 29 MM, 1 MM PITCH, MS-034AAM-1, FBGA-780
Pin Count 780 780
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 622.08 MHz 717 MHz
Combinatorial Delay of a CLB-Max 2.99 ns 5.117 ns
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e1 e0
Length 29 mm 29 mm
Number of CLBs 60440 60440
Number of Inputs 364 364
Number of Logic Cells 60440 60440
Number of Outputs 364 364
Number of Terminals 780 780
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 60440 CLBS 60440 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 220
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 20
Width 29 mm 29 mm
Base Number Matches 1 2
Moisture Sensitivity Level 3

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