EP2SGX60CF780C5N vs EP2SGX60DF780C5 feature comparison

EP2SGX60CF780C5N Altera Corporation

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EP2SGX60DF780C5 Intel Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description 29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780 29 X 29 MM, 1 MM PITCH, MS-034AAM-1, FBGA-780
Pin Count 780
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
Clock Frequency-Max 640 MHz 640 MHz
Combinatorial Delay of a CLB-Max 5.962 ns 5.962 ns
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e1 e0
Length 29 mm 29 mm
Moisture Sensitivity Level 3 3
Number of CLBs 60440 60440
Number of Inputs 364 364
Number of Logic Cells 60440 60440
Number of Outputs 364 364
Number of Terminals 780 780
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 60440 CLBS 60440 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 29 mm 29 mm
Base Number Matches 1 2

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