EP2SGX30DF780C4 vs EP2SGX30DF780C4N feature comparison

EP2SGX30DF780C4 Intel Corporation

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EP2SGX30DF780C4N Altera Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 29 X 29 MM, 1 MM PITCH, MS-034AAM-1, FBGA-780 29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 717 MHz 717 MHz
Combinatorial Delay of a CLB-Max 5.117 ns 5.117 ns
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e0 e1
Length 29 mm 29 mm
Moisture Sensitivity Level 3 3
Number of CLBs 33880 33880
Number of Inputs 361 361
Number of Logic Cells 33880 33880
Number of Outputs 361 361
Number of Terminals 780 780
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 33880 CLBS 33880 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code BGA
Pin Count 780
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

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Compare EP2SGX30DF780C4N with alternatives