EP2SGX130GF1508C3N
vs
EP2SGX130GF1508I3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
ALTERA CORP
Package Description
40 X 40 MM, 1 MM PITCH, LEAD FREE, MS-034AAU-1, FBGA-1508
40 X 40 MM, 1 MM PITCH, FBGA-1508
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Intel
Clock Frequency-Max
717 MHz
622.08 MHz
Combinatorial Delay of a CLB-Max
4.672 ns
3.139 ns
JESD-30 Code
S-PBGA-B1508
S-PBGA-B1508
JESD-609 Code
e1
e0
Length
40 mm
40 mm
Moisture Sensitivity Level
3
Number of CLBs
132540
132540
Number of Inputs
734
734
Number of Logic Cells
132540
132540
Number of Outputs
734
734
Number of Terminals
1508
1508
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
132540 CLBS
132540 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1508,39X39,40
BGA1508,39X39,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
40 mm
40 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
1508
Compare EP2SGX130GF1508C3N with alternatives
Compare EP2SGX130GF1508I3 with alternatives