EP2S60F672I4N vs EP2S60F672C4N feature comparison

EP2S60F672I4N Intel Corporation

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EP2S60F672C4N Altera Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-672 35 X 35 MM, 1 MM PITCH, FBGA-672
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel Intel
Clock Frequency-Max 717 MHz 717 MHz
Combinatorial Delay of a CLB-Max 5.117 ns 5.117 ns
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e1 e1
Length 27 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3022 24176
Number of Inputs 492 492
Number of Logic Cells 60440 60440
Number of Outputs 484 484
Number of Terminals 672 672
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 3022 CLBS 24176 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA672,26X26,40 BGA1020,32X32,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 2.6 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 35 mm
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code BGA
Pin Count 672
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

Compare EP2S60F672I4N with alternatives

Compare EP2S60F672C4N with alternatives