EP2S60F672I4N
vs
EP2S60F672I4
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-672
35 X 35 MM, 1 MM PITCH, FBGA-672
Pin Count
672
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
717 MHz
717 MHz
Combinatorial Delay of a CLB-Max
5.117 ns
5.117 ns
JESD-30 Code
S-PBGA-B672
S-PBGA-B672
JESD-609 Code
e1
Length
27 mm
35 mm
Moisture Sensitivity Level
3
3
Number of CLBs
3022
24176
Number of Inputs
492
492
Number of Logic Cells
60440
60440
Number of Outputs
484
484
Number of Terminals
672
672
Operating Temperature-Max
100 °C
100 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
3022 CLBS
24176 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA672,26X26,40
BGA672,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
2.6 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
27 mm
35 mm
Base Number Matches
1
2
Samacsys Manufacturer
Intel
Compare EP2S60F672I4N with alternatives
Compare EP2S60F672I4 with alternatives