EP2S60F672I4N vs EP2S60F672I4 feature comparison

EP2S60F672I4N Altera Corporation

Buy Now Datasheet

EP2S60F672I4 Intel Corporation

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-672 35 X 35 MM, 1 MM PITCH, FBGA-672
Pin Count 672
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 717 MHz 717 MHz
Combinatorial Delay of a CLB-Max 5.117 ns 5.117 ns
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e1
Length 27 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3022 24176
Number of Inputs 492 492
Number of Logic Cells 60440 60440
Number of Outputs 484 484
Number of Terminals 672 672
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 3022 CLBS 24176 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA672,26X26,40 BGA672,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 2.6 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 27 mm 35 mm
Base Number Matches 1 2
Samacsys Manufacturer Intel

Compare EP2S60F672I4N with alternatives

Compare EP2S60F672I4 with alternatives