EP2S60F1020C3N
vs
EP2S60F1020C3N
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
Part Package Code |
BGA
|
|
Package Description |
33 X 33 MM, 1 MM PITCH, FBGA-1020
|
33 X 33 MM, 1 MM PITCH, FBGA-1020
|
Pin Count |
1020
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
Intel
|
Clock Frequency-Max |
717 MHz
|
717 MHz
|
Combinatorial Delay of a CLB-Max |
4.45 ns
|
4.45 ns
|
JESD-30 Code |
S-PBGA-B1020
|
S-PBGA-B1020
|
JESD-609 Code |
e1
|
e1
|
Length |
33 mm
|
33 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
24176
|
24176
|
Number of Inputs |
718
|
718
|
Number of Logic Cells |
60440
|
60440
|
Number of Outputs |
710
|
710
|
Number of Terminals |
1020
|
1020
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
24176 CLBS
|
24176 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1020,32X32,40
|
BGA1020,32X32,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.5 mm
|
3.5 mm
|
Supply Voltage-Max |
1.25 V
|
1.25 V
|
Supply Voltage-Min |
1.15 V
|
1.15 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
33 mm
|
33 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare EP2S60F1020C3N with alternatives
Compare EP2S60F1020C3N with alternatives