EP2S30F484C5 vs EP2S30F484C3N feature comparison

EP2S30F484C5 Altera Corporation

Buy Now Datasheet

EP2S30F484C3N Intel Corporation

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description 23 X 23 MM, 1 MM PITCH, FBGA-484 23 X 23 MM, 1 MM PITCH, FBGA-484
Pin Count 484
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel Intel
Clock Frequency-Max 640 MHz 717 MHz
Combinatorial Delay of a CLB-Max 5.962 ns 4.45 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 13552 13552
Number of Inputs 342 342
Number of Logic Cells 33880 33880
Number of Outputs 334 334
Number of Terminals 484 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 13552 CLBS 13552 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 23 mm 23 mm
Base Number Matches 2 1

Compare EP2S30F484C5 with alternatives

Compare EP2S30F484C3N with alternatives