EP2S130F780I4 vs EP2S130F780I4 feature comparison

EP2S130F780I4 Intel Corporation

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EP2S130F780I4 Altera Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 29 X 29 MM, 1 MM PITCH, FBGA-780 29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e0 e0
Length 29 mm 29 mm
Number of CLBs 7047 7047
Number of Inputs 534 534
Number of Logic Cells 132540 132540
Number of Outputs 526 526
Number of Terminals 780 780
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 7047 CLBS 7047 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code BGA
Pin Count 780
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 220

Compare EP2S130F780I4 with alternatives

Compare EP2S130F780I4 with alternatives