EP2S130F780C4N vs EP2S130F780I4 feature comparison

EP2S130F780C4N Intel Corporation

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EP2S130F780I4 Altera Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 717 MHz
Combinatorial Delay of a CLB-Max 5.117 ns
JESD-30 Code S-PBGA-B780 S-PBGA-B780
JESD-609 Code e1 e0
Length 29 mm 29 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6627 7047
Number of Inputs 534 534
Number of Logic Cells 132540 132540
Number of Outputs 526 526
Number of Terminals 780 780
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 6627 CLBS 7047 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA780,28X28,40 BGA780,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
Base Number Matches 1 2
Pbfree Code No
Part Package Code BGA
Pin Count 780
Peak Reflow Temperature (Cel) 220

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