EP2S130F1508I4N vs EP2S130F1508C3N feature comparison

EP2S130F1508I4N Altera Corporation

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EP2S130F1508C3N Intel Corporation

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description 40 X 40 MM, 1 MM PITCH, LEAD FREE, FBGA-1508 40 X 40 MM, 1 MM PITCH, LEAD FREE, FBGA-1508
Pin Count 1508
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 717 MHz 717 MHz
Combinatorial Delay of a CLB-Max 5.117 ns 4.672 ns
JESD-30 Code S-PBGA-B1508 S-PBGA-B1508
JESD-609 Code e1 e1
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6627 6627
Number of Inputs 1126 1126
Number of Logic Cells 132540 132540
Number of Outputs 1118 1118
Number of Terminals 1508 1508
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 6627 CLBS 6627 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1508,39X39,40 BGA1508,39X39,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 40 mm 40 mm
Base Number Matches 2 2

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