EP2S130F1508I4N
vs
EP2S130F1508C3N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
40 X 40 MM, 1 MM PITCH, LEAD FREE, FBGA-1508
40 X 40 MM, 1 MM PITCH, LEAD FREE, FBGA-1508
Pin Count
1508
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
717 MHz
717 MHz
Combinatorial Delay of a CLB-Max
5.117 ns
4.672 ns
JESD-30 Code
S-PBGA-B1508
S-PBGA-B1508
JESD-609 Code
e1
e1
Length
40 mm
40 mm
Moisture Sensitivity Level
3
3
Number of CLBs
6627
6627
Number of Inputs
1126
1126
Number of Logic Cells
132540
132540
Number of Outputs
1118
1118
Number of Terminals
1508
1508
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
6627 CLBS
6627 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1508,39X39,40
BGA1508,39X39,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
40 mm
40 mm
Base Number Matches
2
2
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