EP2C8F256I6
vs
EP2C8F256C6N
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
INTEL CORP
INTEL CORP
Package Description
FBGA-256
LEAD FREE, FBGA-256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ALSO REQUIRES 3.3 SUPPLY
ALSO REQUIRES 3.3 SUPPLY
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Length
17 mm
17 mm
Number of CLBs
540
516
Number of Inputs
182
182
Number of Logic Cells
8256
8256
Number of Outputs
174
174
Number of Terminals
256
256
Organization
540 CLBS
516 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
2
2
Samacsys Manufacturer
Intel
Clock Frequency-Max
500 MHz
Moisture Sensitivity Level
3
Operating Temperature-Max
85 °C
Operating Temperature-Min
Temperature Grade
OTHER
Compare EP2C8F256I6 with alternatives
Compare EP2C8F256C6N with alternatives